[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Solder Resist Crack Resistance Process Characterization in BGA Package for Automotive Grade Reliability
Muniandy, Kesvakumar V.C., Jin, Chan Kheng, Peter., J.LYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654301
File:
PDF, 397 KB
english, 2018