[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Trace line Layout Design of FO-WLCSP
Shen, Yih-Ting, Liu, Yu-Hsiang, Chiang, Kuo-NingYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733539
File:
PDF, 588 KB
english, 2019