Highly efficient planarization of sliced 4H–SiC (0001)...

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International Journal of Machine Tools and Manufacture 2019 / 7

Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing

Yang, Xu, Yang, Xiaozhe, Kawai, Kentaro, Arima, Kenta, Yamamura, Kazuya
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Language:
english
Journal:
International Journal of Machine Tools and Manufacture
DOI:
10.1016/j.ijmachtools.2019.103431
Date:
July, 2019
File:
PDF, 2.98 MB
english, 2019
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