Microtexture and Strain in Electroplated Copper...

MRS Proceedings 2000 Vol. 612

Microtexture and Strain in Electroplated Copper Interconnects

Spolenak, R., Barr, D. L., Gross, M. E., Evans-Lutterodt, K., Brown, W. L., Tamura, N., Macdowell, A. A., Celestre, R. S., Padmore, H. A., Valek, B. C., Bravman, J. C., Flinn, P., Marieb, T., Keller,
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Volume:
612
Year:
2000
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-612-D10.3.1
File:
PDF, 107 KB
english, 2000
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