A New Technique for the Characterization of the Adhesion in...

A New Technique for the Characterization of the Adhesion in Integrated Circuit Interconnect Structures

Ocana, Ibon, Molina, Jon M., Gonzalez, Diego, Elizalde, M. Reyes, Sanchez, Jose M., Martinez-Esnaola, Jose M., Gil-Sevillano, Javier, Scherban, Tracey, Pantuso, Daniel, Sun, Brad, Xu, Guanghai, Miner,
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Volume:
863
Year:
2005
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-863-B1.2
File:
PDF, 364 KB
english, 2005
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