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Evaluation of Residual Stress and Warpage of Device Embedded Substrates with Piezo-Resistive Sensor Silicon Chips
Han, Younggun, Horiuchi, Osamu, Hayashi, Shigehiro, Nogita, Kanta, Katoh, Yoshihisa, Nanami, Kyosuke, Tomokage, HajimeVolume:
8
Year:
2015
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.8.81
File:
PDF, 3.95 MB
2015