Investigation of Plasma Activated Si-Si Bonded Interface by...

Micromachines 2019 / 07 Vol. 10; Iss. 7

Investigation of Plasma Activated Si-Si Bonded Interface by Infrared Image Based on Combination of Spatial Domain and Morphology

Du, Mao, Li, Dongling, Liu, Yufei
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Volume:
10
Language:
english
Journal:
Micromachines
DOI:
10.3390/mi10070445
Date:
July, 2019
File:
PDF, 3.93 MB
english, 2019
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