Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures
Du, Cheng-Jie, Li, Xin, Mei, Yun-Hui, Lu, Guo-QuanLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-01601-9
Date:
July, 2019
File:
PDF, 1.96 MB
english, 2019