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[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - High Temperature Lightweight Heat Pipes for Solid-State Power Amplifier (SSPA) Thermal Management
Ababneh, Mohammed T., Tarau, Calin, Anderson, William G.Year:
2019
Language:
english
DOI:
10.1109/ITHERM.2019.8757426
File:
PDF, 42 KB
english, 2019