[IEEE 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Singapore, Singapore (2019.3.12-2019.3.15)] 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Advanced Packaging Drivers/Opportunities to Support Emerging Artificial Intelligence Applications
England, Luke, Tremble, Eric, Arsovski, Igor, Sauter, WolfgangYear:
2019
Language:
english
DOI:
10.1109/EDTM.2019.8731314
File:
PDF, 399 KB
english, 2019