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[IEEE 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Shanghai, China (2019.5.19-2019.5.23)] 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Die-attach on Copper by Pressureless Silver Sintering in Formic Acid
Wang, Meiyu, Xie, Yijing, Mei, Yunhui, Li, Xin, Lu, Guo-QuanYear:
2019
Language:
english
DOI:
10.1109/ISPSD.2019.8757605
File:
PDF, 4.38 MB
english, 2019