A facile and novel method to retard intermetallic compounds formation by inserting Cu3Sn interlayer
Ren, Siru, Guo, Yukun, Kang, Wenbin, Hang, Tao, Hu, Anmin, Li, MingLanguage:
english
Journal:
Materials Research Express
DOI:
10.1088/2053-1591/ab30da
Date:
July, 2019
File:
PDF, 627 KB
english, 2019