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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Thin Film Capacitor Technology for Improving Broadband Power Integrity

Kuhn, William, Fund, Andrew, Wolf, J Ambrose, Schwartz, Robert, Claypool, James, OKeefe, Matthew, Huebner, Wayne
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2019.2901569
File:
PDF, 949 KB
english, 2019
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