[IEEE 2019 6th International Workshop on Low Temperature...

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[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Room temperature bonding of GaN on diamond by using Mo/Au nano-adhesion layer

Wang, Kang, Ruan, Kun, Hu, Wen-Bo, Wu, Sheng-Li, Wang, Hong-Xing
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Year:
2019
Language:
english
DOI:
10.23919/LTB-3D.2019.8735406
File:
PDF, 213 KB
english, 2019
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