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Fabrication and stacking of through-silicon-via array chip formed by notchless Si etching and wet cleaning of first metal layer
Watanabe, Naoya, Kikuchi, Hidekazu, Yanagisawa, Azusa, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro, Nakamura, AkioVolume:
58
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/1347-4065/ab088d
Date:
June, 2019
File:
PDF, 1.28 MB
english, 2019