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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - High Density metal alloy Interconnections Using Novel Wafer Bonding Approach For 3D IC Packaging Applications
Kumar, C Hemanth, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv GovindYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654432
File:
PDF, 331 KB
english, 2018