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[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A Novel Biomimetic Flapping Fan for Electronics Cooling
Benner, Jingru, Mortazavi, Mehdi, Santamaria, Anthony D., Su, Shun, Nguyen, TonyYear:
2019
DOI:
10.1109/ITHERM.2019.8757349
File:
PDF, 1.71 MB
2019