Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints
Min, Kyung Deuk, Myung, Woo-Ram, Kim, Kyung-Yeol, Sung, Yong-Gue, Jung, Seung-BooVolume:
19
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2019.17063
Date:
October, 2019
File:
PDF, 28.64 MB
2019