![](/img/cover-not-exists.png)
Low-temperature wetting of sapphire using Sn–Ti active solder alloys
Mu, Dekui, Feng, Kuiyuan, Lin, Qiaoli, Huang, HanLanguage:
english
Journal:
Ceramics International
DOI:
10.1016/j.ceramint.2019.07.239
Date:
July, 2019
File:
PDF, 2.64 MB
english, 2019