[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
Dudek, Rainer, Kreyssig, Kerstin, Rzepka, Sven, Novak, Michael, Gruebl, Wolfgang, Fruehauf, Peter, Weigert, AndreasYear:
2019
Language:
english
DOI:
10.1109/ITHERM.2019.8757318
File:
PDF, 33 KB
english, 2019