Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
Zhao, Meng, Zhang, Liang, Liu, Zhi-quan, Xiong, Ming-yue, Sun, Lei, Jiang, Nan, Xu, Kai-kaiLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-01878-w
Date:
July, 2019
File:
PDF, 2.74 MB
english, 2019