3D Electronics: 3D Sidewall Integration of...

Advanced Electronic Materials 2019 / 07 Vol. 5; Iss. 7

3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019)

Wu, Xiaoxiang, Ma, Haiguang, Yin, Han, Pan, Danfeng, Wang, Junzhuan, Yu, Linwei, Xu, Jun, Shi, Yi, Chen, Kunji
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Volume:
5
Journal:
Advanced Electronic Materials
DOI:
10.1002/aelm.201970034
Date:
July, 2019
File:
PDF, 3.38 MB
2019
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