Rapid growth kinetics of intermetallic Ni3Ti compound under...

Materials Letters 2019 / 11 Vol. 254

Rapid growth kinetics of intermetallic Ni3Ti compound under electrostatic levitation state

Wang, L., Hu, L., Geng, D.L., Wei, B.
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Volume:
254
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2019.07.086
Date:
November, 2019
File:
PDF, 2.23 MB
english, 2019
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