Effect of hexagonal boron nitride on the thermal and dielectric properties of polyphenylene ether resin for high-frequency copper clad laminates
Ge, Mengni, Zhang, Jianfeng, Zhao, Chunlong, Lu, Chen, Du, GuanxiangJournal:
Materials & Design
DOI:
10.1016/j.matdes.2019.108028
Date:
July, 2019
File:
PDF, 8.93 MB
2019