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Incorporation of a nano/micro CuO formulation into phenol formaldehyde (PF) resin: Curing kinetics, morphological analysis, and application
Guo, Congnan, Yi, Tengfei, Morrell, Jeffrey J., Gao, Wei, Zhao, Sisi, Zhan, Ke, Yang, Long, Du, GuanbenLanguage:
english
Journal:
Journal of Wood Chemistry and Technology
DOI:
10.1080/02773813.2019.1636822
Date:
July, 2019
File:
PDF, 840 KB
english, 2019