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Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches
Comart, Ilker, Cetintepe, Cagri, Sagiroglu, Ebru, Demir, Simsek, Akin, TayfunYear:
2019
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/JMEMS.2019.2912745
File:
PDF, 34 KB
2019