[IEEE 2018 IEEE 20th Electronics Packaging Technology...

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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Analysis of Low Profile Ferrite Material Based Planar Shell Core Inductor

Umar, Zeeshan, Engelsberger, Franz Xaver, Wojnowski, Maciej, Hagelauer, Amelie, Weigel, Robert
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Year:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654356
File:
PDF, 305 KB
english, 2018
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