Electro-migration Behavior in Eutectic Sn-Bi Flip Chip...

Journal of Smart Processing 2013 Vol. 2; Iss. 4

Electro-migration Behavior in Eutectic Sn-Bi Flip Chip Solder Joints with Cu-Pillar Electrodes

MURAYAMA, Kei, KURIHARA, Takashi, SAKAI, Taiji, IMAIZUMI, Nobuhiro, SHIMIZU, Kozo, SAKUYAMA, Seiki, HIGASHI, Mitsutoshi
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Volume:
2
Year:
2013
Language:
english
Journal:
Journal of Smart Processing
DOI:
10.7791/jspmee.2.178
File:
PDF, 1.55 MB
english, 2013
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