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Journal of Electronic Materials 2019 / 7

Wettability, Interfacial Behavior and Joint Properties of Sn-15Bi Solder

Wang, Fengjiang, Ding, Yu, Liu, Luting, Huang, Ying, Wu, Mingfang
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Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07473-3
Date:
July, 2019
File:
PDF, 8.10 MB
english, 2019
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