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Enhanced thermal sensitivity of MEMS bolometers integrated with nanometer-scale hole array structures
Zhang, Ya, Qiu, Boqi, Nagai, Naomi, Nomura, Masahiro, Volz, Sebastian, Hirakawa, KazuhikoVolume:
9
Language:
english
Journal:
AIP Advances
DOI:
10.1063/1.5113521
Date:
August, 2019
File:
PDF, 1.15 MB
english, 2019