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[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A Metamodeling Approach for Optimization of Manifold Microchannel Systems for High Heat Flux Cooling Applications
Yuruker, Sevket U., Mandel, Raphael K., Shooshtari, Amir, Ohadi, Michael M.Year:
2019
DOI:
10.1109/ITHERM.2019.8757232
File:
PDF, 37 KB
2019