[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Enhancement of the Electrical and Thermal Performance of AlGaN/GaN HEMTs Using a Novel Resistive Field Plate Structure
Chatterjee, Bikramjit, Kim, Tae Kyoung, Song, Yiwen, Lundh, James Spencer, Han, Sang-Woo, Shoemaker, Daniel, Lee, Jae Min, Cho, Moon Uk, Chu, Rongming, Kwak, Joon Seop, Choi, SukwonYear:
2019
DOI:
10.1109/ITHERM.2019.8757330
File:
PDF, 35 KB
2019