Interplay of Wettability, Interfacial Reaction and...

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Journal of Electronic Materials 2019 / 7

Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples

Soares, Thiago, Cruz, Clarissa, Silva, Bismarck, Brito, Crystopher, Garcia, Amauri, Spinelli, José Eduardo, Cheung, Noé
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Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07454-6
Date:
July, 2019
File:
PDF, 2.23 MB
english, 2019
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