![](/img/cover-not-exists.png)
[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Air-Based Cooling in High Porosity, Aluminum Foams for Compact Electronics Cooling
Panse, Sanskar S., Singh, Prashant, Ekkad, Srinath V.Year:
2019
DOI:
10.1109/ITHERM.2019.8757458
File:
PDF, 33 KB
2019