[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Room temperature bonding of GaN on diamond by using Mo/Au nano-adhesion layer
Wang, Kang, Ruan, Kun, Hu, Wen-Bo, Wu, Sheng-Li, Wang, Hong-XingYear:
2019
DOI:
10.23919/LTB-3D.2019.8735406
File:
PDF, 213 KB
2019