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Dynamic Contact Characteristics During Chemical Mechanical Polishing (CMP)
Choi, Wonseop, Lee, Seung-Mahn, Singh, Rajiv K.Volume:
767
Year:
2003
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-767-F1.10
File:
PDF, 124 KB
english, 2003