[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Molded Electronic Package Warpage Predictive Modelling Methodologies
Ong, Kang Eu, Loh, Wei Keat, Kulterman, Ron W., Hsu, Chih Chung, Wang, Jenn An, Fu, HaleyYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733601
File:
PDF, 2.64 MB
english, 2019