Peculiarities of Sn Grain Boundary Diffusion in Dilute Cu-based Alloys
Nikulkina, V., Rodin, A., Bokstein, B.Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2019.126525
Date:
August, 2019
File:
PDF, 1.01 MB
english, 2019