Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
Cheng, Hao, Peng, Yang, Mou, Yun, Sun, Qinglei, Chen, MingxiangVolume:
141
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4043645
Date:
May, 2019
File:
PDF, 4.29 MB
2019