[IEEE 2019 IEEE Custom Integrated Circuits Conference (CICC) - Austin, TX, USA (2019.4.14-2019.4.17)] 2019 IEEE Custom Integrated Circuits Conference (CICC) - High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging
Ayazi, Farrokh, Wen, Haoran, Jeong, Yaesuk, Gupta, Pranav, Daruwalla, Anosh, Liu, Chang-ShunYear:
2019
Language:
english
DOI:
10.1109/CICC.2019.8780183
File:
PDF, 34 KB
english, 2019