[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling
Kamrul Hasan, S. M., Fahim, Abdullah, Suhling, Jeffrey C., Hamasha, Sa'd, Lall, PradeepYear:
2019
Language:
english
DOI:
10.1109/ITHERM.2019.8757348
File:
PDF, 40 KB
english, 2019