High Thermal Boundary Conductance across Heterogeneous...

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ACS Applied Materials & Interfaces 2019 / 08

High Thermal Boundary Conductance across Heterogeneous GaN-SiC Bonded Interfaces

Mu, Fengwen, Cheng, Zhe, Shi, Jingjing, Shin, Seongbin, Xu, Bin, Shiomi, Junichiro, Graham, Samuel, Suga, Tadatomo
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Language:
english
Journal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.9b10106
Date:
August, 2019
File:
PDF, 1.60 MB
english, 2019
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