Copper nanomaterials and assemblies for soft electronics;...

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Science China Materials 2019 / 8

Copper nanomaterials and assemblies for soft electronics; 基于铜纳米材料及其组装的柔性电子技术;

Feng, Yang, Zhu, Jian
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Language:
english
Journal:
Science China Materials
DOI:
10.1007/s40843-019-9468-5
Date:
August, 2019
File:
PDF, 9.13 MB
english, 2019
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