Dynamic Thermal Management for 3-D ICs With Time-Dependent...

IEEE Transactions on Components Packaging and Manufacturing Technology 2019 / 7 Vol. 9; Iss. 7

Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

Li, Yong-Sheng, Yu, Huan, Jin, Hang, Sarvey, Thomas E., Oh, Hanju, Bakir, Muhannad S., Swaminathan, Madhavan, Li, Er-Ping
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
9
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2920974
Date:
July, 2019
File:
PDF, 37 KB
2019
Conversion to is in progress
Conversion to is failed