Microstructures and properties of SnAgCu lead-free solders...

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Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles

Zhao, Meng, Zhang, Liang, Liu, Zhi-quan, Xiong, Ming-yue, Sun, Lei, Jiang, Nan, Xu, Kai-kai
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Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-01878-w
Date:
July, 2019
File:
PDF, 2.74 MB
2019
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