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[IEEE 2019 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2019.3.18-2019.3.19)] 2019 China Semiconductor Technology International Conference (CSTIC) - A Novel Method for STI Top Corner Rounding by Etch Process to Improve Leakage and SRAM Performance
Gu, LinYear:
2019
Language:
english
DOI:
10.1109/CSTIC.2019.8755606
File:
PDF, 1.36 MB
english, 2019