[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Investigation of Elastic Fields within Through-silicon Vias using a Finite Element Model with Thermal Stresses and Joule Heating Present
Zeng, Qibiao, Gao, Yuan, Zhen, Yubao, Zhou, PengYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480505
File:
PDF, 2.38 MB
english, 2018