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Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration
Cheng, Shu-Feng, Huang, Po-Tsang, Wang, Li-Chun, Chang, Mau-Chung FrankYear:
2019
Language:
english
Journal:
IEEE Design & Test
DOI:
10.1109/MDAT.2019.2932935
File:
PDF, 1.05 MB
english, 2019