Multi-physics Modeling & Characterization of Components...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Multi-physics Modeling & Characterization of Components on Flexible Substrates

Sivapurapu, Sridhar, Chen, Rui, Mehta, Chirag, Zhou, Yi, Bellaredj, Mohamed L F, Jia, Xiaotong, Kohl, Paul, Huang, Tsung-Ching, Sitaraman, Suresh K., Swaminathan, Madhavan
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2931452
File:
PDF, 1.21 MB
english, 2019
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