[IEEE 2018 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Chandigarh, India (2018.12.16-2018.12.18)] 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Method to Model Input Voltage Ripple in Multi-Domain Fully Integrated Voltage Regulators

Govindan, Srinivasan, Gope, Dipanjan, Bharath, Krishna, Venkataraman, Srikrishnan
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Year:
2018
Language:
english
DOI:
10.1109/edaps.2018.8680865
File:
PDF, 327 KB
english, 2018
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